金洙吉

金洙吉，男，1967年出生，毕业于哈尔滨工业大学，现任大连理工大学精密与特种加工教育部重点实验室教授，同时也是博士生和硕士生的导师。

1985.09-1989.07：大庆石油学院石油机械专业，获学士学位

1989.09-1992.03：哈尔滨工业大学机械设计专业，获硕士学位

1992.03-1995.11：哈尔滨工业大学机械设计专业，获博士学位

1998年于大连理工大学机械工程专业博士后出站留校任教，现任大连理工大学精密与特种加工教育部重点实验室教授、博士生导师。

中国机械工程学会生产工程分会光整加工技术委员会副主任委员

中国机械工程学会特种加工分会青年工作委员会委员

中国机械工程学会生产工程分会青年工作委员会委员

主要研究方向是精密与超精密加工技术、难加工材料高效加工技术、特种加工及其控制技术。主持国家973计划子课题2项、国家自然科学基金委重大研究计划培育项目1项、国家自然科学基金面上项目2项、辽宁省科学基金2项、GF预研项目2项、大连市科技计划项目1项。作为主要研究人员参加完成国家自然科学基金重大项目、重点项目各1项、国家自然科学基金面上项目2项，以及多项国防预研和横向协作项目。发表学术论文60余篇，其中SCI、EI检索40余篇，申报发明专利14项。获得教育部技术发明一等奖1项，航天部科技进步三等奖2项。

1、精密与超精密加工技术

2、难加工材料高效加工

3、特种加工及其控制技术

共发表论文60余篇，近年来主要论文有：

1. Zewei Yuan, Zhuji Jin, Renke Kang andQuan Wen.Tribochemical polishing CVD diamond film with FeNiCr alloy polishingplate prepared by MA-HPS technique. Diamond & Related Materials, 2012, 21, pp.50-57.

2. Zewei Yuan, Zhuji Jin, Quan Wen and KunWang. Polishing CVD diamond wafer by compound methods. International Journal ofMachining and Machinability of Materials, 2012.1.

3. Z.J. Jin, Z.W. Yuan, Q. Li and K.Wang. TribologicalAspects of Chemical Mechanical Polishing Diamond surfaces. Key EngineeringMaterials, 2011,325, pp. 464-469.

4.Heng Zhen Dai, ZhuJi Jin, Shang Gao, Z.C. Tao. Research on the Chemical-Mechanical Grinding (CMG)Tools for Al2O3 Ceramic. Advanced Materials Research,2011, 325, pp 270-275.,

5. Wei Si Li, DongMing Guo, Zhu Ji Jin, Zhe Wang, Ze Wei Yuan. Effects of High DielectricConstant Abrasives on ECMP, Applied Mechanics and Materials, 2011, 121-126, pp3263-3267

6. 苑泽伟, 金洙吉, 王坤, 温泉.CVD金刚石膜高效超精密抛光技术, 纳米技术与精密工程, 2011, 9(5), 451-458.

7.周平, 郭东明, 康仁科, 金洙吉. 多级粗糙间隙内的两相微流动数值模拟, 机械工程学报, 2011,47(15), 83-88.

8. 周平, 郭东明, 金洙吉, 康仁科. 多级粗糙表面对抛光液微流动影响的数值分析, 机械工程学报, 2011, 47(9),169-174.

9. Guo Dongming, XuChi, Kang Renke and Jin Zhuji. Model analysis and experimental investigation ofthe friction torque during the CMP process, Journal of Semiconductors, 2011,32(3), 036002.

10. Wang Cailing, KangRenke, Jinzhuji and Guo Dongming. Effects of the reciprocating parameters ofthe carrier on material removal rate and non-uniformity in CMP. Journal ofSemiconductors, 2010, 31(12), 126001.

11. Xu Chi, GuoDongming, Jin Zhuji, Kang Renke. A signal processing method for thefriction-based endpoint detection system of a CMP process. Journal ofSemiconductors, 2010, 31(12), 126002.

12. 王彩玲, 康仁科, 金洙吉. 一种用于化学机械抛光的加压装置设计研究. 中国机械工程, 2010, 21(7),839-842.

13. 刘瑞鸿, 郭东明, 金洙吉, 康仁科. 摩擦化学反应活化能在SiO2-CMP中的作用, 纳米技术与精密工程, 2010, 8(3), 275-280.

14. Jin ZJ, Yuan ZW, Kang RK and Dong BX.Fabrication and Characterization of FeNiCr Matrix-matrix-TiC composite forpolishing CVD diamond film. Journal of Material Science and Technology, 2009,25(3), pp 319-324.

15. Z.J.Jin, Z.W.Yuan, R.K.Kang andB.X.Dong. Study on two kinds of grinding wheels for dynamic friction polishingof CVD diamond film, Key Engineering Materials, 2009, 389-390, pp 217-222.

16. MA Xingwei, JINZhuji, YAN Shi, XU Jiujun. Effect of La2O3 onmicrostructure and high-temperature wear property of hot-press sintering FeAlintermetallic compound. JOURNAL OF RARE EARTHS, 2009, 27(6), pp 1031-1036.

17. 郭晓光, 郭东明, 康仁科, 金洙吉. 机群系统上单晶硅磨削过程分子动力学仿真并行化研究. 系统仿真学报, 2009, (10),2850-2854.

18. Z. W. Yuan, Z. J. Jin, B. X. Dong andR. K. Kang. Polishing of free-standing CVD diamond films by the combination ofEDM and CMP. Advanced Materials Research, 2008, 53-54, pp 111-118.

19. Z.J. Jin, X.W. Ma and Z.W. Yuan. Thehigh-efficient low-cost wheel-grinding technology for CVD diamond films,Advanced Materials Research, 2007, 24-25, pp 295-302.

20. F.W. Huo, Z.J.Jin,R.K.Kang, D.M.Guo. A method for grinding mode indentification in grinding ofsilicon wafers. Adwance Materials Research. 2007, 24-25, pp 255-230.

21. F.W. Huo, Z.J.Jin,et al. Experimental investigation of brittle to ductile transition of singlecrystal silicon by single grain grinding. Key Engineering Materials. 2007, 329,pp 433-438.

22. 霍凤伟，金洙吉，康仁科，郭东明. 金刚石砂轮形貌测量中的磨粒识别研究. 大连理工大学学报, 2007, 47（3）, 358-362.

23. J.Y.Liu, Z.J.Jin,D.M.Guo, R.K. Kang. Effects of suspending abrasives on the lubricationproperties of slurry in chemical mechanical polishing of silicion wafer. KeyEngineering Materials, 2006, 304-305, pp 359-363.

24. J.Y.Liu, D.M.Guo,Z.J.Jin, R.K. Kang. A suspeding abrasives and porous pad model for the analysisof lubrication in chemical mechanical polishing, Key Engineering Materials,2006, 315-316. pp 775-778.