冯雪

冯雪，毕业于重庆大学，清华大学教授、博导，应用力学教育部重点实验室副主任^[1]。

2011.12-任清华大学航天航空学院，教授、博导。2010.1-2010.7任美国伊利诺伊大学（UIUC）材料科学与工程系，访问学者。2017.09任清华大学成立柔性电子技术研究中心主任。

时间院校专业学位1994.9-1998.7重庆大学工程力学系、自动化系学士1998.9-2003.1清华大学工程力学系，固体力学博士、硕士

2004.9-2007.7任美国伊利诺伊大学（UIUC）机械工程系，博士后。

2005.7-2006.8任美国加州理工学院（Caltech）航空系，访问博士后。

2007.7-2011.12任清华大学航天航空学院，副研究员。

2011.12-任清华大学航天航空学院，教授、博导。

2010.1-2010.7任美国伊利诺伊大学（UIUC）材料科学与工程系，访问学者。

2017.09任清华大学成立柔性电子技术研究中心主任。

研究领域

薄膜/界面力学、柔性可延展电子器件、极端复杂环境下实验力学、航天航空热防护等

研究概况

近年来主要从事复杂环境下固体材料/结构的物理力学性能及失效机理研究，发展复杂环境试验方法及多学科交叉创新型实验力学。先后主持和承担了基金委近空间飞行器重大研究计划培育项目、国家科技重大专项、教育部优秀博士论文基金项目、基金委国际合作重大项目、基金委重点项目等

学术成果

至今已正式发表SCI论文50多篇，英文书章1篇；已授权国家发明专利6项、自主软件著作权3项。

[1]Wang ZH, Shi NL, Zhang YC, Zheng N, Li HC, Jiao Y, Cheng JH, Wang YT, Zhang XQ, Chen Y, Chen YH, Wang HL, Xie T, Wang YJ, Ma YJ*, Gao XR*, Feng X*, “Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces,” Nature Communications, 14: 4213, 2023.

[2]Chen XY, Jian W, Wang ZJ, Ai J, Kang Y, Sun PC, Wang ZH, Ma YJ, Wang HL, Chen Y*, Feng X*, “Wrap-like transfer printing for three-dimensional curvy electronics,” Science Advances, 9: eadi0357, 2023.

[3]Wang FL, Jin P, Feng YL, Fu J, Wang P, Liu X, Zhang YC, Ma YJ, Yang YY, Yang AM, Feng X*, “Flexible doppler ultrasound device for the monitoring of blood flow velocity”, Science advances, 7(44):eabi9283, 2021.

[4]Jin P, Fu J, Wang FL, Zhang YC, Wang P, Liu X, Jiao Y, Li HF, Chen Y, Ma YJ, Feng X*, “A flexible, stretchable system for simultaneous acoustic energy transfer and communication,” Science advances, 7: eabg2507, 2021.

[5]Chen SY, Lyu WH, Wang G, Chen Y, Ma YJ*, Feng X*, “Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing,” International Journal of Solids and Structures, 223: 111009, 2021.

[6]Liu X, Cao Y, Zheng KW, Zhang YC, Wang ZH, Chen YH, Chen Y, Ma YJ*, Feng X*, “Liquid droplet stamp transfer printing,” Advanced Functional Materials, 31: 2105407, 2021.

[7]Li HF, Wang P, Jiao Y, Jin P, Lu BW, Chen Y, Ma YJ*, Feng X*, “Mechanics of pressure driven transfer printing for stamp with micropillar,” Mechanics of Materials, 160: 103960, 2021.

[8]Xu JX, Fu CY, Fu QQ, Chen Y, Ma YJ*, Feng X*, “Flexible arc-armor inspired by origami,” International Journal of Mechanical Sciences, 201: 106463, 2021.

[9]Ma YJ, Zhang YC, Cai SS, Han ZY, Liu X, Wang FL, Cao Y, Wang ZH, Li HF, Chen YH, Feng X*, “Flexible hybrid electronics for digital healthcare,” Advanced Materials, 32: 1902062, 2020.

[10]Li HC, Ma YJ, Liang ZW, Wang ZH, Cao Y, Xu Y, Zhou H, Lu BW, Chen Y, Han ZY, Cai SS, Feng X*, “Wearable skin-like optoelectronic systems with suppression of motion artifact for cuff-less continuous blood pressure monitor,” National Science Review, 7: 849-862, 2020.

[11]Zhang YC, Zheng N, Cao Y, Wang FL, Wang P, Ma YJ, Lu BW, Hou GH, Fang ZZ, Liang ZW, Yue MK, Li Y, Chen Y, Fu J, Wu J, Xie T, Feng X*, “Climbing-inspired twining electrodes using shape memory for peripheral nerve stimulation and recording,” Science Advances, 5: eaaw1066, 2019.

[12]Zhang YC, Wu J, Ma YJ, Chen Y, Chen Y, Lu BW, Feng X*, “A finite deformation theory for the climbing habits and attachment of twining plants,” Journal of the Mechanics and Physics of Solids, 116: 171-184, 2018.

[13]Yue MK., Dong XL, Fang X and Feng X. Effect of interface reaction and diffusion on stress-oxidation coupling at high temperature. Journal of Applied Physics, 15: 123, 2018.

[14]Chen YH, Lu SY, Zhang SS, Li Y, Qu Z, Chen Y, Lu BW, Wang XY, Feng X*, “Skin-like biosensor system via electrochemical channels for noninvasive blood glucose monitoring,” Science Advances, 3: e1701629, 2017.

[15]Su HH, Fang XF, Qu Z, Zhang C, Yan B and Feng X, Synchronous full-field measurement of temperature and deformation of C/SiC composite subjected to flame heating at high temperature. Experimental Mechanics, 56: 659-671, 2016.

[16]Wang YX, Chen Y, Li HC, Li XM, Chen H, Su HH, Lin Y, Xu Y, Song G F, Feng, X*, “Buckling-Based Method for Measuring the Strain-Photonic Coupling Effect of GaAs Nanoribbons,” ACS Nano, 10: 8199-8206, 2016.

[17]Dong X, Fang X, Feng X and Hwang KC. Diffusion and stress coupling effect during oxidation at high temperature. Journal of the American Ceramic Society, 96(1): 44-46, 2013.

[18]Chen H, Feng X*, HuangY, Huang YG*, Rogers JA, “Experiments and Viscoelastic Analysis of Peel Test with Patterned Strips for Applications to Transfer Printing,” Journal of the Mechanics and Physics of Solids, 61: 1737–1752, 2013.

[19]Feng X, Meitl MA, Bowen AM, Huang YG*, Nuzzo RG, Rogers JA*, “Competing fracture in kinetically controlled transfer printing,” Langmuir, 23: 12555-12560, 2007.

参考资料^[3]

中国力学学会实验力学专业委员会委员、学科交叉与复杂环境实验方法专业组组长、电子电磁器件工作组委员、智能材料与结构工作专业组委员、对外交流与合作委员会委员等

时间奖项全称获得奖项2006年-全国百篇优秀博士论文奖2007年教育部自然科学奖一等奖2008年教育部科技发明奖一等奖2008年-清华大学学术新人奖2009年-教育部“新世纪人才支持计划”2011年-入选清华大学221计划2011年-第十二届中国力学学会青年科技奖2012年基金委优秀青年基金2022年第二十四届中国科协求是杰出青年成果转化奖^[4]-—何梁何利基金科学与技术奖青年创新奖^[5]2023年入选2023年中国科学院院士增选有效候选人名单^[6]-